COMPLAS 2025

Keynote

Constrained Bending of Paperboard Analysed with Digital Image Correlation and Finite Element Simulations

  • Borgqvist, Eric (Tetra Pak Packaging Solutions)
  • Lacaj, Endri (Lund University Division of Solid Mechanics)
  • Claesson, Filip (Gemello Engineering)
  • Bäckström, Anton (Lund Univiersity)
  • Hall, Stephen (Lund University Division of Solid Mechanics)
  • Wallin, Mathias (Lund University Division of Solid Mechanics)
  • Ristinmaa, Matti (Lund University Division of Solid Mechanics)

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A common material frequently used for food and beverage packaging containers is paperboard. The material typically consists of several plies, each with a unique fiber composition and thereby mechanical performance. It is crucial that no cracks nucleate during the industrial manufacturing process from paperboard to the final package. If cracks occur, these are commonly induced by bending deformation. Unfortunately there are limited number of tests available which measure the bending strength of paperboard. To meet this need, this work presents a new experimental setup where the paperboard is bent under axial constraints. Recordings of the constrained three point bending have been made where the through thickness deformation of the paperboard is captured. Full field measurements at the surface of the sample are then performed through digital image correlation techniques. Local and global approaches are employed to resolve the material kinematics for a wide range of deformations. Using an adapted correlation grid, localized effects across the structural layers leading to material failure are also captured. The strain levels obtained in this way are compared to the failure strains obtained from uniaxial tensile tests performed on the individual plies of the paperboard. The individual plies have been extracted from the paperboard by mechanical separation using a device that cuts the paperboard through thickness. Furthermore, the strain fields obtained from the DIC are compared to the fields predicted by Finite Element Simulations using the model developed in \cite{Borgqvist2015} and the results will be discussed.